1. 2. 3. material content data sheet sales product name bcr 35pn h6327 issued 29. august 2013 ma# MA001094640 package pg-sot363-6-1 weight* 6.28 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal arsenic 7440-38-2 0.000 0.00 16 noble metal gold 7440-57-5 0.010 0.16 1595 inorganic material silicon 7440-21-3 0.086 1.36 1.52 13623 15234 leadframe inorganic material silicon 7440-21-3 0.001 0.01 92 non noble metal titanium 7440-32-6 0.003 0.05 459 non noble metal chromium 7440-47-3 0.009 0.14 1376 non noble metal copper 7440-50-8 2.869 45.67 45.87 456638 458565 wire non noble metal copper 7440-50-8 0.010 0.16 0.16 1621 1621 encapsulation organic material carbon black 1333-86-4 0.030 0.48 4817 plastics epoxy resin - 0.651 10.36 103565 inorganic material silicondioxide 60676-86-0 2.346 37.33 48.17 373315 481697 leadfinish non noble metal tin 7440-31-5 0.213 3.39 3.39 33936 33936 plating noble metal silver 7440-22-4 0.056 0.89 0.89 8947 8947 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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